Following July of this year, Guangdong once again opened an early warning of patent analysis of LED package MOCVD equipment. A few days ago, the Guangdong Province Intellectual Property Office held the province's LED industry packaging and MOCVD equipment field core patent analysis and early warning report meeting in Zhongshan.
According to a report by Fan Guanghan, a professor at the Institute of Optoelectronic Materials and Technology of South China Normal University, China is ahead of other countries in the number of original patent applications in the field of LED packaging, followed by the Japanese team, with the United States and South Korea ranking third and fourth. The research and development strength of LED packaging abroad is not only concentrated on the structure, but also on the packaging material. China mainly focuses on the design of LED packaging structure. When a better material is used, it is easy to be controlled by people.
In addition, foreign applications for packaging technology and structure focus on quality. Once high-quality patents are available, they will apply for patents of the same family to various countries through PCT and other channels, and China is their main target market. It can be seen from the structure patents that most of the thermoelectric separation structures in China generally follow Philips lumens. China has a large number of applications for packaging structures, but it has not gone to the world. From some angles, it can be seen that its own patent quality Not confident.
Philips, Samsung, Cree, LG, Panasonic and other well-known manufacturers in the world's top 10 have applied for a total of 5,263 patents, which is the applicant's future main competitors in the packaging field. Looking back at Chinese applicants, the top three are Taiwan's Yiguang Electronic Industry Co., Ltd., Hongqi Technology Co., Ltd. and Yiquan Precision Industry Co., Ltd., which account for 18%, 13% and 11 of the top 10 application questions in China. %, Indicating that Taiwan has good strength in the packaging field. In the future, Taiwan â€™s LED packaging industry will remain a strong competitor. The top six patent applicants in the mainland are Heshan Lide Electronic Industry Co., Ltd., Foshan Guoxing Optoelectronics Co., Ltd., Tsinghua University, University of Electronic Science and Technology, Guangzhou Nanke Integrated Electronics Co., Ltd., and Rainbow Group Company.
The report also shows that in the field of MOCVD, from the application trends of the five major original countries or regions of the United States, Japan, South Korea and Germany, and Taiwan, except for the United States and Japan, which started earlier, the other three countries and regions all have The application started in the mid-1990s. Although some of these five countries and regions started earlier, the overall patent situation has been consistent since 2000, and the number of applications has increased rapidly.
China started late, the number of patents in this field is still not large, the originality and quality are not ideal, and there is no advantage. German AIXTRON and American VEECO have leading advantages in MOCVD technology, occupying 90% of the world's market share. Its core patents cover the design of the growth reaction chamber, heating, and stage design. Patent layout is the core technical point of MOCVD equipment.
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