Jiangxi Lianchuang Optoelectronics Technology Co., Ltd. announced that it will issue 200 million yuan of 365 days unsecured short-term financing bonds on the 8th. The short-term bond payment and interest date of this period is March 9, the listing date is March 12, and the due payment date is March 9, 2013. The bond issuance rate is determined based on the results of bookkeeping and centralized placement.
According to the comprehensive assessment of Dagong International, the credit rating of this short-term securities is A-1, and the long-term credit rating of the company is A+. Industrial Bank (601166, stock bar) served as the lead underwriter of this issue.
Lianchuang Optoelectronics announced that 150 million yuan of funds will be supplemented with liquidity for the procurement of raw materials and accessories, as well as labor and electricity, and 50 million yuan for repayment of bank loans.
Antenk Standard D-Sub Series Including:
Standard Straight D-Sub Connectors Stamped Contacts
Standard High Profile D-Sub machined contacts
Standard Wire Wrap D-Sub Connectors Machined Contacts
Standard Straight D-Sub Connectors Machined Contacts
Standard Dip Solder D-Sub Connector Straight Machined Economy
Standard Density Vertical Low Profile D-Sub Connectors
Standard Density Press Fit D-Sub Connectors
Antenk's Vertical D-Sub Connectors Options
Number of Rows
Features of Antenk's Vertical D-Sub Standard Connectors
Available in 5 industry sizes/positions
Standard Density ( 9 pin , 15 pin, 25 pin , 37 pin , 50 pin).
Low cost & high performance, non-removable stamped contacts.
Nickel shells have indents to provide grounding and additional retention.
Optional mounting d-sub hardware available.
Materials of Antenk's Vertical D-Sub Standard Connectors
Shell: Steel, nickel plated
Insulator: Glass-filled thermoplastic. U.L. rated 94V-O
(260Â°C process temp)
Male pins - Brass | Female pins - Phosphor bronze
Plating: Gold flash on entire contact
(contact factory for other plating options)
Antenk Vertical High Density D-Sub Series Including:
Dip Solder High Density D-Sub Connectors Stamped Contacts
Vertical Solder High Density D-Sub Connectors Machined
High Density D-Sub Vertical Low Profile Stamped Contacts
High Density D-Sub Vertical Low Profile Machined Contacts
High Density D-Sub Vertical High Profile Stamped Contacts
Features of Antenk's Vertical D-Sub High Density Connectors
High Profile d-subs available in Standard Density: (15 pin, 26 pin)
Stamped contacts for lower cost.
Available in receptacle (female).
Metal shell provide EMI/RFI shielding.
High profile design allows placement of other components on PCB.
Available with various hardware options.
Materials of Antenk's Vertical D-Sub High Density Connectors
Shell: Steel, nickel plated
Insulator: Thermoplastic polyester, chemical resistant, black UL 94V-O (230Â°C process temp)
Contacts: Female pins - Phosphor bronze
Plating: Gold flash over nickel (mating area) | Tin over nickel (solder tails)
wire wrap vertical board mount d-sub connectors, high profile vertical board mount d-sub connectors, low profile vertical board mount d-sub connectors, dip solder and press fit vertical board mount d-sub connectors
ShenZhen Antenk Electronics Co,Ltd , https://www.antenk.com