Lianchuang Optoelectronics plans to issue 200 million yuan 365 days short-term securities on March 8.

Jiangxi Lianchuang Optoelectronics Technology Co., Ltd. announced that it will issue 200 million yuan of 365 days unsecured short-term financing bonds on the 8th. The short-term bond payment and interest date of this period is March 9, the listing date is March 12, and the due payment date is March 9, 2013. The bond issuance rate is determined based on the results of bookkeeping and centralized placement.

According to the comprehensive assessment of Dagong International, the credit rating of this short-term securities is A-1, and the long-term credit rating of the company is A+. Industrial Bank (601166, stock bar) served as the lead underwriter of this issue.

Lianchuang Optoelectronics announced that 150 million yuan of funds will be supplemented with liquidity for the procurement of raw materials and accessories, as well as labor and electricity, and 50 million yuan for repayment of bank loans.

 

Antenk Standard D-Sub Series Including:
Standard Straight D-Sub Connectors  Stamped Contacts
Standard High Profile D-Sub  machined contacts
Standard Wire Wrap D-Sub Connectors  Machined Contacts
Standard Straight D-Sub Connectors  Machined Contacts
Standard Dip Solder D-Sub Connector Straight  Machined  Economy
Standard Density  Vertical Low Profile  D-Sub Connectors
Standard Density  Press Fit D-Sub Connectors

Antenk's Vertical D-Sub Connectors Options 
Number of Rows
Shell Size
Mounting Style
Packaging
Gender
Shell 

Features of Antenk's Vertical D-Sub Standard Connectors 
Available in 5 industry sizes/positions
Standard Density ( 9 pin , 15 pin, 25 pin , 37 pin , 50 pin).
Low cost & high performance, non-removable stamped contacts.
Nickel shells have indents to provide grounding and additional retention.
Optional mounting d-sub hardware available.

Materials of Antenk's Vertical D-Sub Standard Connectors 
Shell: Steel, nickel plated
Insulator: Glass-filled thermoplastic. U.L. rated 94V-O
(260°C process temp)
Stamped contacts:
Male pins - Brass | Female pins - Phosphor bronze
Plating: Gold flash on entire contact
(contact factory for other plating options)

Antenk Vertical  High Density D-Sub  Series Including: 
Dip Solder High Density D-Sub Connectors  Stamped Contacts
Vertical Solder High Density D-Sub Connectors  Machined
High Density D-Sub  Vertical Low Profile  Stamped Contacts
High Density D-Sub  Vertical Low Profile  Machined Contacts
High Density D-Sub  Vertical High Profile  Stamped Contacts

Features of  Antenk's Vertical D-Sub High Density Connectors 
High Profile d-subs available in Standard Density: (15 pin, 26 pin)
Stamped contacts for lower cost.
Available in receptacle (female).
Metal shell provide EMI/RFI shielding.
High profile design allows placement of other components on PCB.
Available with various hardware options.

Materials of Antenk's Vertical D-Sub High Density Connectors 
Shell: Steel, nickel plated
Insulator: Thermoplastic polyester, chemical resistant, black UL 94V-O (230°C process temp)
Contacts: Female pins - Phosphor bronze
Plating: Gold flash over nickel (mating area) | Tin over nickel (solder tails)


Vertical Mount D-Sub Connectors

wire wrap vertical board mount d-sub connectors, high profile vertical board mount d-sub connectors, low profile vertical board mount d-sub connectors, dip solder and press fit vertical board mount d-sub connectors

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